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| IT3 Test Vehicle Assembly Yield Test TR0636E-20009 IT3 Test Vehicle Assembly Yield Test Approved. TY. ARAI June/23rd/2008 Checked. TM. MATSUO June/23rd/2008 Prepared. TY.TAKADA June/23rd/2008 Hirose Electric -1- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 1 OVERVIEW The purpose of this test is to provide customer a way of quantifying the expected manufacturing yield of the IT3 connector system in a mass production environment. This is accomplished by providing statistical data that simulates IT3's mounting performance in a CEM/mass production setting, using pre-existing processes for both mounting and inspection. 2 TEST OBJECTIVES By using the combination of standard mounting processes, typical PCB configuration, and the IT3 connector system, the goal was to provide the following data: Statistical data including: o o o o o A set number of mounts to represent a mass production setting. Differing connector pin-counts and mounting orientations to reflect real applications. Single reflow and double reflow specification, to represent both, top and bottom mountings. Differing process parameters such as paste volume and flux. Reported percentage of any failures. 5DX inspection results o Standard mass-production inspection process. - 2D x-ray inspection results o Determine real failure or false call from 5DX inspection results. -2- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 3 TEST VEHICLES 3.1 Connector Type Mezzanine connector : Hirose IT3 series Receptacle mating side Receptacle IT3M-300S-BGA(57)...Mounting side 300 signal pins (Total 570 joints including ground pins) IT3D-300S-BGA(57)...Mating side 300 signal pins (Total 570 joints including ground pins) IT3M-200S-BGA(57)...Mounting side 200 signal pins (Total 380 joints including ground pins) Receptacle mounting side IT3D-200S-BGA(57)...Mating side 200 signal pins (Total 380 joints including ground pins) -3- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 3.2 Build Matrix The following number of boards and connectors were used to determine results. Total Board Qty : 190 Total Connector Qty : 1900 The assembly yield tests were performed at two CEM mass production locations. CEM1 (Flextronics, Austin) Process order 1 Test board Stencil type 5mil DC 7mil 5mil 2 MB 7mil Total Connector part No. IT3D-200S-BGA(57) IT3D-300S-BGA(57) IT3D-200S-BGA(57) IT3D-300S-BGA(57) IT3M-200S-BGA(57) IT3M-300S-BGA(57) IT3M-200S-BGA(57) IT3M-300S-BGA(57) Board Qty. 30 15 30 20 95 Connector Qty. 150 150 75 75 150 150 100 100 950 Comments Nitrogen atmosphere 2X reflow (2nd reflow with connector on bottom side) Nitrogen atmosphere 1 X reflow CEM2 (Jabil, Penang) Process order Test board DC MB Total Connector part No. IT3D-200S-BGA(57) IT3D-300S-BGA(57) IT3M-200S-BGA(57) IT3M-300S-BGA(57) Board Qty. 45 50 95 Connector Qty. 225 225 250 250 950 Comments Nitrogen atmosphere 2x reflow (2nd reflow w ith connector on bottom side) Nitrogen atmosphere 1 X reflow 1 2 -4- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 4 ASSEMBLY CONDITIONS 4.1 Test Board Design Details Test Board Design Details per IPC-9701 Item 1 2 3 4 5 6 7 8 9 10 Thickness # of Metal Layers Layer Structure PCB Material Ground Layer Signal Layer Daisy Chain Pad and Via Surface Finish Pad Design Requirement 93 mils (2.4mm) 8 layers See Fig. 1 High Tg FR-4 70% copper mesh 30% copper weave Top layer Pads for probing on the bottom layer through via High Tg OSP (Organic solderability preservative) NSMD (Non-solder mask defined) See Fig. 2 Outer layer: 35 microns (1 ounce) 11 Copper Thickness # of Connectors Inner ground: 35 microns (1 ounce) Inner signal: 18 microns (0.5 ounce) 12 10 connectors per board y y Remarks y y y y y y All signal pads are connected in series for electrical measurement Simulate mechanical strength of actual PCBs with signal vias y y Note: Vias are not connected to any specific signal or ground layers. Ground pads and ground inner layers are left unconnected. -5- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 Signal(X-Weaved0 30y cupper) Signal(Y-Weaved0 30y cupper) Signal(Y-Weaved0 30y cupper) Signal(X-Weaved0 30y cupper) Fig. 1 PCB Layer Structure Fig. 2 PCB Pad Design -6- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 4.2 Test board layout PCB size is the same as typical line-cards or motherboards. Connectors were strategically placed around the perimeter in locations that have the highest chance of bad soldering, in both X & Y orientation, and, in a combination of 200 and 300 positions to represent actual application requirements. Boards include a total of 10 connectors, with 8 being placed on the perimeter, and the balance along the center line to show the effects of any board warpage on the mounting of the connectors. The minimum distance from connector edge to from the PCB edge was 50mm. -7- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 4.3 Test Vehicle Assembly Major CEMs' followed current standard practices for mass-production assembly. 4.3.1 Assembly Parameters Process parameters followed during the test. Items Type of Reflow Equipment Pre Conditioning Stencil / Theoretical paste volume Solder Ball Composition Solder Paste (Composition) Process Parameters Reflow atmosphere Requirements Mass-reflow conveyor furnaces Dry package 1. 23 mil round, 5 mil thk / 2076 mil^3 (Flextronics) 2. 28 mil round, 7 mil thk / 4308 mil^3 (Flextronics) 3. 22.4x21.1 ellipse, 5 mil thk / 1943 mil^3 (Jabil) Eutectic: Sn63 Pb37 1. Kester HM531 water-soluble eutectic solder paste (Flextronics) 2. Kester R560 Type 3 water-soluble eutectic solder paste (Jabil) See attached reports from CEMs Nitrogen atmosphere (low O2) 4.3.2 Reflow Temperature Profile CEMs defined reflow temperature profile based on their own pre-existing process referring to HIROSE suggested reflow profile. Example of typical IT3 reflow profile -8- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 Temperature measurement points on Connectors Attached to a BGA joint (Under the connector by inserting T/C through drilled hole on PCB) Attached to a connector body Attached to PCB surface 12.7mm cn1 cn4 cn5 12.7mm cn3 cn2 cn10 cn6 Reflow direction 12.7mm cn7 cn9 12.7mm cn8 12.7mm 4.4 X-ray Inspection X-ray inspection after assembly was conducted. Any connector showing the following failures is checked. : "solder-bridge", "open joint", "voids", "solder ball mis-alignment", or "insufficient solder". All Mother boards and daughter cards were 100% inspected using 5DX x-ray. All 5DX calls were reported, and then verified with 2D x-ray to determine if real failure. -9- IT3 Test Vehicle Assembly Yield Test TR0636E-20009 5. RESULTS See attached reports from CEMs (Flextronics and Jabil) for more details. 1. No issues were found in this validation run with respect to board design and it's manufacturability. 2. 99.9% connector yield was achieved (Total connector failure rate 0.1%). 3. Total pin failure rate 2.2 DPMJ (Defect Per Million Joints) 4. Three paste volumes showed good results. 5. Both Kester HM531 and R560 solder pastes showed good results. 5DX Calls Signal Pin Stencil Type 5mil 300 pins 7mil DC 5mil 200 pins 7mil CEM1 Flextronics MB 5mil 200 pins 7mil Total 300 pins MB 200 pins CEM2 Jabil 300 pins DC 200 pins Total Total 5mil 225 950 1,900 85,500 451,250 902,500 0 0 53 0 0 2.8 0 0 91 0 0 100.8 0 0 2 0 0 0.1 5mil 5mil 250 225 95,000 128,250 0 0 0 0 0 0 0 0 0 0 0 0 5mil 100 950 250 38,000 451,250 142,500 27 53 0 27.0 5.6 0 57 91 0 1500.0 201.7 0 0 2 0 0 0.2 0 150 57,000 2 1.3 2 35.1 0 0 5mil 300 pins 7mil 100 57,000 12 12.0 19 333.3 1 1.0 75 150 28,500 85,500 3 3 4.0 2.0 3 4 105.3 46.8 0 1 0 0.7 150 57,000 0 0 0 0 0 0 75 42,750 6 8.0 6 140.4 0 0 Connectors Tested 150 Pins Tested 85,500 0 Connector # of Conn. Call Rate % # of Pins Failure Pin Call Rate DPMJ Connector # of Conn. Failure Rate % # of Pins Pin Failure Rate DPMJ 0 0 0 0 0 0 0 0 0 1 1 0 0 2 0 0 0 0 0 2 0 0 0 0 11.7 17.5 0 0 4.4 0 0 0 0 0 2.2 - 10 - IT3 Test Vehicle Assembly Yield Test TR0636E-20009 6. REVISION RECORD Revision no. Description (Major changes) Initial release Date June 23rd, 2008 - 11 - |
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